Machining Oxygen-Free High Conductivity Copper (C10100): Speeds & Feeds, Tooling & Best Practices

Technical machining guide for Oxygen-Free High Conductivity Copper (C10100) (Pure Electronic Copper (99.99%)): optimal cutting speeds (80 - 180 m/min), feeds (0.05 - 0.15 mm/tooth), hardness (40-60 HB), and precision manufacturing practices.

Engineering Specifications & Parameters

Chip Load (fz) 0.05 - 0.15 mm/tooth
Material Grade Oxygen-Free High Conductivity Copper (C10100)
Material Hardness 40-60 HB
Cutting Speed (Vc) 80 - 180 m/min
Alloy Classification Pure Electronic Copper (99.99%)
Primary Applications Particle accelerator RF cavities, high-power water-cooled he...

Material Properties & Machinability Profile

Oxygen-Free High Conductivity Copper (C10100) is classified as a Pure Electronic Copper (99.99%) widely specified for mission-critical components requiring Particle accelerator RF cavities, high-power water-cooled heat sinks, and vacuum electronics electrodes..

Engineering Kinematics & Cutting Parameters

  • Material Hardness: 40-60 HB.
  • Recommended Cutting Speed ($V_c$): 80 - 180 m/min with dedicated substrate coatings.
  • Chip Load ($f_z$): Maintained between 0.05 - 0.15 mm/tooth to prevent tool rubbing or excessive mechanical shock.
  • Machinability Challenge: 101% IACS electrical conductivity; highly ductile and gummy with heavy burr formation; requires polished single-crystal diamond.
  • Tooling Strategy: Employs high-pressure flood coolant (>= 30 bar) and micro-grain carbide or specialized inserts with positive rake geometries.

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Frequently Asked Questions

What cutting speed is recommended for Oxygen-Free High Conductivity Copper (C10100)?

Optimal cutting speeds range from 80 - 180 m/min depending on roughing vs finishing passes and machine tool rigidity.

How does UCAN ROBOT manage tool wear when cutting Oxygen-Free High Conductivity Copper (C10100)?

We implement in-process tool monitoring, rigid toolholder systems, and high-pressure through-spindle coolant to dissipate cutting heat immediately.