C110 (Electrolytic Tough Pitch Copper) offers 100% IACS electrical conductivity and ultra-high thermal dissipation, making it essential for semiconductor heatsinks, power busbars, and EDM electrodes.
PEEK-CF30 is an ultra-high performance thermoplastic reinforced with 30% short carbon fibers, providing metal-grade flexural stiffness, low thermal expansion, and extreme wear resistance.
Acrylic (Polymethyl Methacrylate / Plexiglass) offers crystal-clear 92% light transmittance, exceptional UV weatherability, and high surface hardness for optical lenses and light guides.
ULTEM 1000 (Polyetherimide) is an amber semi-transparent high-performance polymer offering high dielectric strength, broad chemical resistance, and continuous temperature capability up to 170°C.
2024-T3 is a high-strength copper-alloyed aircraft aluminum offering superior fatigue resistance and fracture toughness, widely specified for structural aerospace wing and fuselage skins.
5052-H32 is a non-heat-treatable magnesium-alloyed aluminum known for outstanding saltwater corrosion resistance, high weldability, and excellent formability in marine and chassis components.
POM (Polyoxymethylene), commonly known as Delrin or Acetal, is a high-rigidity engineering thermoplastic offering exceptional dimensional stability, low friction, and clean chip formation.
Ti-6Al-4V (Grade 5) is the preeminent titanium alloy, combining extraordinary strength, low density, and high biocompatibility, with low thermal conductivity requiring dedicated cooling.
316L is a low-carbon austenitic stainless steel enhanced with molybdenum, providing superior resistance to chlorides, pitting, and marine/medical corrosion.